Capabilities Matrix

PRECISION
DELIVERED.

Hardware design and manufacturing coordination, from first sketch to volume production. Every service built around getting your product to market reliably.

developer_board
01 // LAYOUT

PCB Design & Layout

Multi-layer signal integrity focused layouts. Differential pair routing, impedance matching, and EMI/EMC mitigation for demanding applications.

  • chevron_right Up to 16 Layer Boards
  • chevron_right GHz Range Signal Integrity
  • chevron_right Rigid-Flex Assemblies
  • chevron_right IPC-A-610 Class 3 Standards
Capabilities
Layer Count Up to 16
High-Speed Design GHz+
HDI Design Supported
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02 // BUILD

Product Prototyping

From schematic to working hardware. We take your concept through design, layout, and validation — delivering production-ready files or a fully built prototype through our trusted partner network.

Gerbers + BOM Delivered
DFM Review Included
Turnkey Solution Available
PCB prototype
03 // PRODUCTION

Manufacturing Consultation & DFM

Production planning and consultation through our trusted manufacturing partners. Design for Manufacturability review, SMT assembly guidance, and quality assurance advisory from prototype to scale.

DFM Review Partner Selection BOM Management Partner Network
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04 // ADVISORY

Hardware Consulting

Technical guidance for hardware teams. Architecture review, component selection, thermal analysis, and production readiness assessment. We help you make the right decisions early.

architecture Architecture Review
thermostat Thermal Analysis
checklist Readiness Audit
05 // CODE

Software & Firmware

We write the software that runs on your hardware. From bare-metal microcontroller firmware to full embedded Linux BSP development, device drivers, and application-layer code. Your product isn't done when the PCB works — it's done when the whole system works.

Embedded Linux BSP Development RTOS / Bare-Metal Device Drivers OTA Updates Communication Stacks
// firmware_main.c
#include "nitra_hal.h"
#include "drivers/spi.h"
 
int main(void) {
hal_init();
spi_configure(SPI_MODE_3);
sensor_start();
while(1) {
process_data();
transmit_packet();
}
}
0
Design Accuracy
2–8wk
Prototype Turnaround
0
Max PCB Layers
0
Quote Response